InterPACK (International Conference on Electronics Packaging)

InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging, MEMS, and NEMS.

Event Type:

Business - Convention / Expo

Venue:

The Fairmont San Francisco
San Francisco

Overall Range:

Started: 07/06/15
Ended:  07/09/15

Active Schedule:

(past event)

Social:

Telephone:

415-772-5000

Event Cost:

$845 - $995

Past Schedule:

Mon, Jul 6, 2015:
    1:00 pm - 10:30 pm
Tue, Jul 7, 2015:
    7:45 am - 7:30 pm
Wed, Jul 8, 2015:
    7:45 am - 7:00 pm
Thu, Jul 9, 2015:
    7:45 am - 2:30 pm